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Si11 20
1. Electrical Specifications
Table 1. Absolute Maximum Ratings*
Parameter
Supply Voltage
Operating Temperature
Storage Temperature
Voltage on TXO with respect to
Conditions
Min
–0.3
–40
–65
–0.3
Typ
—
—
—
—
Max
5.5
85
85
5.5
Units
V
°C
°C
V
GND
Voltage on all other Pins with
–0.3
—
VDD + 0.3
V
respect to GND
Maximum Total Current through
—
—
500
mA
TXO (TXO active)
Maximum Total Current through
—
—
600
mA
TXGD and VSS
Maximum Total Current through
—
—
100
mA
all other Pins
ESD Rating
Human body model
—
—
2
kV
*Note: Stresses above those listed in this table may cause permanent damage to the device. This is a stress rating only, and
functional operation of the devices at those or any other conditions above those indicated in the operational listings of
this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device
reliability.
Table 2. Recommended Operating Conditions
Parameter
Symbol
Conditions / Notes
Min
Typ
Max
Units
Typical Operating Conditions (T A = 25 °C)
Supply Voltage
V DD
T = –40 to +85 °C,
2.2
3.3
3.7
V
V DD to GND, TXGD
Operating Temperature
–40
25
85
°C
SC/MD/STX High Threshold
SC/MD/STX Low Threshold
VIH
VIL
V DD –0.7
—
—
—
—
0.6
V
V
Active TXO Voltage
1
—
—
1.0
V
ALS Operating Range
Proximity Conversion Frequency 2
LED Emission Wavelength 3
Edc
—
—
600
—
125
850
100
250
950
kLx
Hz
nm
Notes:
1. Minimum R1 resistance should be calculated based on LED forward voltage, maximum LED current, LED voltage rail
used, and maximum active TXO voltage.
2. When in Mode 0 and operating at 250 Hz, STX pulse width should be limited to 1 ms.
3. When using LEDs near the min and max wavelength limits, higher radiant intensities may be needed to achieve the end
system's proximity sensing performance goals.
4
Rev. 1.0
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